소자재료공정개론
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『소자재료공정개론』은 재료를 가공하여 소자를 만드는 공정의 기본 원리를 기술한 책이다. 다른 공정기술과 마찬가지로 재료공정도 몇몇 단위 공정으로 체계화할 수 있으며 이러한 공정들이 응용에 따라 반복적으로 적용이 되면서 제품이 만들어진다. 전자, 화학, 물리, 화공, 기계를 포함한 여러 분야의 과학기술자들에게도 재료공정과 관련하여 좋은 입문서가 될 것이다.
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출판사 리뷰
출판사 리뷰
목차
목차
Chapter 01?서 론
1.1 소재, 소자와 공정 ······································································· 2
1.2 재료의 종류 ·············································································· 14
1.3 반도체기술 로드맵 ···································································· 18
1.4 태양전지·· ················································································· 22
연습문제 ··················································································· 28
Chapter 02?규소소재, 결정성장, 웨이퍼 제조
2.1 규소소재 ··················································································· 30
2.2 결정의 성장 ·············································································· 37
2.3 초크랄스키 결정성장 공정 ························································ 43
2.4 결정성장 공정의 해석 ······························································· 48
2.5 웨이퍼의 제조 ··········································································· 59
연습문제 ··················································································· 70
Chapter 03?세정공정
3.1 오염 물질 ·················································································· 74
3.2 클린룸과 웨이퍼의 세정 ···························································· 77
3.3 게터링공정 ················································································ 81
연습문제 ··················································································· 84
Chapter 04?규소의 산화공정
4.1 산화막의 용도 및 물성 ····························································· 88
4.2 산화공정 ··················································································· 94
4.3 산화공정 시스템 ····································································· 112
연습문제 ················································································· 116
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Chapter 05?확산공정
5.1 고체용액 및 고체상에서의 확산 ·············································· 121
5.2 확산계수 ················································································· 125
5.3 확산방정식과 도판트 분포 ······················································ 130
5.4 확산공정 ················································································· 138
연습문제 ················································································· 144
Chapter 06?이온주입공정
6.1 공정의 기본 원리 ··································································· 148
6.2 레인지이론(range theory) ····················································· 152
6.3 이온 채널링, 결정의 손상 및 어닐링 ····································· 162
연습문제 ················································································· 173
Chapter 07?묘화(lithography) 공정
7.1 광리소그라피 ··········································································· 177
7.2 광원과 노광 시스템 ································································ 181
7.3 감광성 고분자(포토레지스트) ·················································· 190
7.4 리소그라피공정 ······································································· 197
연습문제 ················································································· 204
Chapter 08?플라즈마 공정
8.1 플라즈마의 특성 ····································································· 209
8.2 플라즈마 화학반응 ·································································· 216
8.3 플라즈마 반응 시스템 ····························································· 222
연습문제 ················································································· 225
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Chapter 09?화학증착공정(CVD: chemical vapor deposition)
9.1 CVD공정의 특징 및 역사 ······················································· 228
9.2 CVD공정의 분류 ····································································· 236
9.3 화학증착 전구체 ····································································· 241
9.4 공정의 기본 원리 ··································································· 256
9.5 화학증착공정의 응용 ······························································· 272
9.6 원자층 화학증착 ····································································· 287
연습문제 ················································································· 295
참고문헌 ················································································· 297
Chapter 10?물리증착공정(PVD: physical vapor deposition)
10.1 물리증착법의 특징 ································································ 300
10.2 증발법 ·················································································· 302
10.3 스퍼터링법 ············································································ 310
10.4 금속화공정 ············································································ 319
연습문제 ················································································· 324
Chapter 11?식각공정(etching)
11.1 식각 메카니즘 ······································································ 328
11.2 반응 시스템 ·········································································· 341
11.3 반도체소자에의 응용 ···························································· 348
11.4 화학 기계적 연마 ································································· 351
연습문제 ················································································· 363
참고문헌 ················································································· 365
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부 록···································································· 367
부록 1 단위 및 상수들 ··································································368
부록 2 단위 변환표 ········································································371
부록 3 원자들의 특성 ····································································372
부록 4 실리콘의 물성(300°K) ·······················································375
부록 5 Complementary Error Function Table ··························376
찾아보기································································ 377
1.1 소재, 소자와 공정 ······································································· 2
1.2 재료의 종류 ·············································································· 14
1.3 반도체기술 로드맵 ···································································· 18
1.4 태양전지·· ················································································· 22
연습문제 ··················································································· 28
Chapter 02?규소소재, 결정성장, 웨이퍼 제조
2.1 규소소재 ··················································································· 30
2.2 결정의 성장 ·············································································· 37
2.3 초크랄스키 결정성장 공정 ························································ 43
2.4 결정성장 공정의 해석 ······························································· 48
2.5 웨이퍼의 제조 ··········································································· 59
연습문제 ··················································································· 70
Chapter 03?세정공정
3.1 오염 물질 ·················································································· 74
3.2 클린룸과 웨이퍼의 세정 ···························································· 77
3.3 게터링공정 ················································································ 81
연습문제 ··················································································· 84
Chapter 04?규소의 산화공정
4.1 산화막의 용도 및 물성 ····························································· 88
4.2 산화공정 ··················································································· 94
4.3 산화공정 시스템 ····································································· 112
연습문제 ················································································· 116
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Chapter 05?확산공정
5.1 고체용액 및 고체상에서의 확산 ·············································· 121
5.2 확산계수 ················································································· 125
5.3 확산방정식과 도판트 분포 ······················································ 130
5.4 확산공정 ················································································· 138
연습문제 ················································································· 144
Chapter 06?이온주입공정
6.1 공정의 기본 원리 ··································································· 148
6.2 레인지이론(range theory) ····················································· 152
6.3 이온 채널링, 결정의 손상 및 어닐링 ····································· 162
연습문제 ················································································· 173
Chapter 07?묘화(lithography) 공정
7.1 광리소그라피 ··········································································· 177
7.2 광원과 노광 시스템 ································································ 181
7.3 감광성 고분자(포토레지스트) ·················································· 190
7.4 리소그라피공정 ······································································· 197
연습문제 ················································································· 204
Chapter 08?플라즈마 공정
8.1 플라즈마의 특성 ····································································· 209
8.2 플라즈마 화학반응 ·································································· 216
8.3 플라즈마 반응 시스템 ····························································· 222
연습문제 ················································································· 225
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Chapter 09?화학증착공정(CVD: chemical vapor deposition)
9.1 CVD공정의 특징 및 역사 ······················································· 228
9.2 CVD공정의 분류 ····································································· 236
9.3 화학증착 전구체 ····································································· 241
9.4 공정의 기본 원리 ··································································· 256
9.5 화학증착공정의 응용 ······························································· 272
9.6 원자층 화학증착 ····································································· 287
연습문제 ················································································· 295
참고문헌 ················································································· 297
Chapter 10?물리증착공정(PVD: physical vapor deposition)
10.1 물리증착법의 특징 ································································ 300
10.2 증발법 ·················································································· 302
10.3 스퍼터링법 ············································································ 310
10.4 금속화공정 ············································································ 319
연습문제 ················································································· 324
Chapter 11?식각공정(etching)
11.1 식각 메카니즘 ······································································ 328
11.2 반응 시스템 ·········································································· 341
11.3 반도체소자에의 응용 ···························································· 348
11.4 화학 기계적 연마 ································································· 351
연습문제 ················································································· 363
참고문헌 ················································································· 365
x
부 록···································································· 367
부록 1 단위 및 상수들 ··································································368
부록 2 단위 변환표 ········································································371
부록 3 원자들의 특성 ····································································372
부록 4 실리콘의 물성(300°K) ·······················································375
부록 5 Complementary Error Function Table ··························376
찾아보기································································ 377
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