육안 검사 자동화 기술
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자동 육안 검사 장치는 공학기술, 전기-전자기술, 기계기술의 3가지와 소프트 기술이 밀접하게 연관되어 구성되어 있다. 본서에서는 결함을 검출하는 센싱 기술, 검사를 위한 데이터 처리 알고리즘, 실용적인 신호처리 하드웨어 등에 중점을 두고 구성은 크게 2파트로 육안 검사 자동화를 위한 요소 기술과 육안 검사 자동화의 실용 기술로 꾸며 보았다.
저자는 이 책에 육안 검사를 자동화 하는데 필요한 지식을 먼저 생각해 볼 수 있도록 하였으며 이러한 지식을 바탕으로 실제적으로 육안 검사 자동화 시스템을 구성해 볼 수 있도록 함으로써 이론과 실용을 강조하였다.
저자는 이 책에 육안 검사를 자동화 하는데 필요한 지식을 먼저 생각해 볼 수 있도록 하였으며 이러한 지식을 바탕으로 실제적으로 육안 검사 자동화 시스템을 구성해 볼 수 있도록 함으로써 이론과 실용을 강조하였다.
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제 Ⅰ 단원 육안 검사 자동화를 위한 요소 기술
제 1장 육안 검사 자동화의 개요 ·································································· 13
1.1 측정과 검사의 구별 ······················································································· 15
1.1.1 측정의 문제 ···························································································· 15
1.1.2 계측과 측정의 차이 ·············································································· 16
1.1.3 측정과 검사의 차이 ·············································································· 17
1.2 비파괴 검사의 개요 ······················································································ 18
1.2.1 비파괴 검사의 정의 ·············································································· 18
1.2.2 비파괴 검사의 원리 ············································································· 18
1.2.3 비파괴 검사의 종류와 특징 ································································ 18
1.3 검사의 목적과 동향 ······················································································ 22
1.3.1 검사의 목적 ··························································································· 22
1.3.2 검사의 동향 ·························································································· 24
1.4 육안 검사 시스템의 사례 ············································································ 25
1.4.1 전기전자 산업에의 응용 ······································································ 25
1.4.2 자동 제조 산업에의 응용 ···································································· 27
1.4.3 고밀도 실장 회로판 제조 공정에의 응용 ········································· 29
1.4.4 비전 검사 ······························································································ 35
1.5 검사의 문제점 ······························································································· 37
1.5.1 검사 기술의 문제점 ············································································· 37
1.5.2 검사의 자동화를 위한 문제점 ···························································· 38
1.6 육안 검사와 자동화 ······················································································ 39
1.6.1 서론 ········································································································ 39
1.6.2 자동화의 순서 ······················································································· 41
제 2장 광학 기술의 개요 ·············································································· 45
2.1 광학의 개요 ··································································································· 47
2.1.1 광의 편광 ······························································································· 47
2.1.2 굴절과 반사 ·························································································· 50
2.1.3 빛의 산란 ······························································································ 56
2.1.4 빛의 회절 ······························································································ 57
2.2 광원의 개요 ··································································································· 62
2.2.1 백색 광원 ······························································································ 62
2.2.2 레이저 다이오드 ·················································································· 62
2.2.3 발광 다이오드 ····················································································· 80
2.3 광센서의 개요 ······························································································· 85
2.3.1 광전 현상 ······························································································ 85
2.3.2 광전 소자의 특성표시법 ····································································· 93
2.3.3 광센서 ··································································································· 95
2.4 조도 ·············································································································· 113
2.5 조명계 ··········································································································· 115
제 3장 신호처리와 변환 기술의 개요 ························································ 117
3.1 전기회로 소자 ······························································································ 119
3.1.1 저항기 ··································································································· 119
3.1.2 콘덴서 ·································································································· 122
3.1.3 인덕터 ·································································································· 125
3.2 전자회로 소자 ····························································································· 130
3.2.1 진성반도체의 성질 ·············································································· 131
3.2.2 n형 반도체와 p형 반도체 ································································ 132
3.2.3 다이오드 ······························································································ 133
3.2.4 트랜지스터 ·························································································· 136
3.3 전기전자 회로의 개요 ················································································ 144
3.3.1 다이오드 회로 ····················································································· 144
3.3.2 트랜지스터 회로 ················································································ 154
3.3.3 연산 증폭 회로 ·················································································· 163
3.4 신호 변환의 개요 ······················································································· 167
3.4.1 기본적인 입력 회로 ··········································································· 167
3.4.2 매칭 회로 ··························································································· 180
3.4.3 신호의 증폭 ························································································ 184
3.4.4 파형 변환 ···························································································· 187
3.4.5 논리 회로 ··························································································· 200
3.4.6 연산 회로 ··························································································· 209
3.4.7 샘플링과 양자화 ················································································ 220
제 Ⅱ 단원 육안 검사 자동화의 실용 기술
제 4장 외관 결함의 센싱 ············································································ 229
4.1 외관 결함과 광학 정보 관계 ····································································· 231
4.2 표면 오염 ···································································································· 232
4.3 표면흠집, 표면 거칠함, 먼지 부착 ························································· 234
4.4 요철 ············································································································· 238
4.5 윤곽 ·············································································································· 241
4.6 투명체 ·········································································································· 244
4.7 용기의 누설 ································································································ 246
4.8 둘레 전체의 검사 ······················································································· 247
제 5장 광센서의 이용법 ·············································································· 249
5.1 점 센서의 이용법 ························································································ 251
5.1.1 일반사항 ······························································································· 251
5.1.2 광전자증배관 ······················································································ 254
5.1.3 포토다이오드 ······················································································ 256
5.2 라인 센서의 이용법 ··················································································· 258
5.3 면 센서의 이용법 ······················································································· 261
5.4 플라잉스폿 시스템 ····················································································· 264
5.5 플라잉이미지 시스템 ················································································· 267
5.6 밀착형 이미지센서 ····················································································· 268
5.7 결상 광학계 ································································································ 269
5.8 화상의 떨림 방지 ······················································································· 271
제 6장 검사의 알고리즘 ·············································································· 275
6.1 비교기준 데이터의 표현법 ········································································ 277
6.1.1 피측정물 내부에서의 비교 ································································ 277
6.1.2 창성된 정상 패턴과의 비교 ····························································· 280
6.1.3 형상 특성치와의 비교 ······································································· 283
6.1.4 결함 국소 패턴의 유무 판정 ··························································· 286
6.1.5 실물과의 비교 ···················································································· 288
6.1.6 설계 데이터와의 비교 ······································································ 290
6.1.7 메모리상의 화상 데이터와의 비교 ··················································· 291
6.2 화상 데이터의 절감법 ··············································································· 292
6.2.1 정점 샘플링 ······················································································ 292
6.2.2 라인 ····································································································· 293
6.2.3 윈도우 ································································································· 295
6.2.4 마스킹(masking) ··············································································· 296
6.2.5 화상 데이터의 차원 압축 ································································ 296
6.3 비교 연산 ···································································································· 299
6.4 위치의 보정 ································································································ 301
6.5 판정 기준 데이터의 설정법 ····································································· 303
제 7장 신호 레벨 해석에 의한 결함 검출 ··············································· 305
7.1 개요 ·············································································································· 307
7.2 신호의 보정 ································································································ 308
7.3 결함부의 강조 ······························································································ 311
7.4 임계값 회로 ································································································· 312
7.5 검사 영역의 절단 ······················································································· 314
제 8장 2차원 화상 처리에 의한 결함 검출 ·············································· 319
8.1 개요 ·············································································································· 321
8.2 2치화와 화소의 분리 ················································································· 323
8.3 파이프라인 처리 회로 ··············································································· 325
8.4 국소 병렬 연산의 응용 예 ······································································· 329
8.5 PC의 이용 ··································································································· 332
제 9장 검사 장치의 구성 ············································································ 333
9.1 점 센서에 의한 형상 검사 장치 ······························································ 335
9.2 라인 센서에 의한 표면 결함 검사 장치 ················································· 338
9.3 영상 카메라를 이용한 윈도우 회로 ························································· 341
제 10장 성능의 검토 ··················································································· 343
10.1 개요 ············································································································ 345
10.2 정도 ············································································································ 345
10.3 분해능 ········································································································ 347
10.3.1 샘플링 정리 ······················································································ 347
10.3.2 촬상소자와 분해능 ·········································································· 349
10.3.3 Laser 주사와 분해능 ····································································· 350
10.3.4 렌즈의 해상력 ·················································································· 352
10.3.5 증폭회로와 분해능 ·········································································· 352
10.3.6 위치결정 정도의 영향 ···································································· 353
10.3.7 분해능의 향상 ·················································································· 354
10.4 검사 속도 ·································································································· 355
10.5 재현성 ········································································································ 356
10.6 그 밖의 평가 ····························································································· 357
제 1장 육안 검사 자동화의 개요 ·································································· 13
1.1 측정과 검사의 구별 ······················································································· 15
1.1.1 측정의 문제 ···························································································· 15
1.1.2 계측과 측정의 차이 ·············································································· 16
1.1.3 측정과 검사의 차이 ·············································································· 17
1.2 비파괴 검사의 개요 ······················································································ 18
1.2.1 비파괴 검사의 정의 ·············································································· 18
1.2.2 비파괴 검사의 원리 ············································································· 18
1.2.3 비파괴 검사의 종류와 특징 ································································ 18
1.3 검사의 목적과 동향 ······················································································ 22
1.3.1 검사의 목적 ··························································································· 22
1.3.2 검사의 동향 ·························································································· 24
1.4 육안 검사 시스템의 사례 ············································································ 25
1.4.1 전기전자 산업에의 응용 ······································································ 25
1.4.2 자동 제조 산업에의 응용 ···································································· 27
1.4.3 고밀도 실장 회로판 제조 공정에의 응용 ········································· 29
1.4.4 비전 검사 ······························································································ 35
1.5 검사의 문제점 ······························································································· 37
1.5.1 검사 기술의 문제점 ············································································· 37
1.5.2 검사의 자동화를 위한 문제점 ···························································· 38
1.6 육안 검사와 자동화 ······················································································ 39
1.6.1 서론 ········································································································ 39
1.6.2 자동화의 순서 ······················································································· 41
제 2장 광학 기술의 개요 ·············································································· 45
2.1 광학의 개요 ··································································································· 47
2.1.1 광의 편광 ······························································································· 47
2.1.2 굴절과 반사 ·························································································· 50
2.1.3 빛의 산란 ······························································································ 56
2.1.4 빛의 회절 ······························································································ 57
2.2 광원의 개요 ··································································································· 62
2.2.1 백색 광원 ······························································································ 62
2.2.2 레이저 다이오드 ·················································································· 62
2.2.3 발광 다이오드 ····················································································· 80
2.3 광센서의 개요 ······························································································· 85
2.3.1 광전 현상 ······························································································ 85
2.3.2 광전 소자의 특성표시법 ····································································· 93
2.3.3 광센서 ··································································································· 95
2.4 조도 ·············································································································· 113
2.5 조명계 ··········································································································· 115
제 3장 신호처리와 변환 기술의 개요 ························································ 117
3.1 전기회로 소자 ······························································································ 119
3.1.1 저항기 ··································································································· 119
3.1.2 콘덴서 ·································································································· 122
3.1.3 인덕터 ·································································································· 125
3.2 전자회로 소자 ····························································································· 130
3.2.1 진성반도체의 성질 ·············································································· 131
3.2.2 n형 반도체와 p형 반도체 ································································ 132
3.2.3 다이오드 ······························································································ 133
3.2.4 트랜지스터 ·························································································· 136
3.3 전기전자 회로의 개요 ················································································ 144
3.3.1 다이오드 회로 ····················································································· 144
3.3.2 트랜지스터 회로 ················································································ 154
3.3.3 연산 증폭 회로 ·················································································· 163
3.4 신호 변환의 개요 ······················································································· 167
3.4.1 기본적인 입력 회로 ··········································································· 167
3.4.2 매칭 회로 ··························································································· 180
3.4.3 신호의 증폭 ························································································ 184
3.4.4 파형 변환 ···························································································· 187
3.4.5 논리 회로 ··························································································· 200
3.4.6 연산 회로 ··························································································· 209
3.4.7 샘플링과 양자화 ················································································ 220
제 Ⅱ 단원 육안 검사 자동화의 실용 기술
제 4장 외관 결함의 센싱 ············································································ 229
4.1 외관 결함과 광학 정보 관계 ····································································· 231
4.2 표면 오염 ···································································································· 232
4.3 표면흠집, 표면 거칠함, 먼지 부착 ························································· 234
4.4 요철 ············································································································· 238
4.5 윤곽 ·············································································································· 241
4.6 투명체 ·········································································································· 244
4.7 용기의 누설 ································································································ 246
4.8 둘레 전체의 검사 ······················································································· 247
제 5장 광센서의 이용법 ·············································································· 249
5.1 점 센서의 이용법 ························································································ 251
5.1.1 일반사항 ······························································································· 251
5.1.2 광전자증배관 ······················································································ 254
5.1.3 포토다이오드 ······················································································ 256
5.2 라인 센서의 이용법 ··················································································· 258
5.3 면 센서의 이용법 ······················································································· 261
5.4 플라잉스폿 시스템 ····················································································· 264
5.5 플라잉이미지 시스템 ················································································· 267
5.6 밀착형 이미지센서 ····················································································· 268
5.7 결상 광학계 ································································································ 269
5.8 화상의 떨림 방지 ······················································································· 271
제 6장 검사의 알고리즘 ·············································································· 275
6.1 비교기준 데이터의 표현법 ········································································ 277
6.1.1 피측정물 내부에서의 비교 ································································ 277
6.1.2 창성된 정상 패턴과의 비교 ····························································· 280
6.1.3 형상 특성치와의 비교 ······································································· 283
6.1.4 결함 국소 패턴의 유무 판정 ··························································· 286
6.1.5 실물과의 비교 ···················································································· 288
6.1.6 설계 데이터와의 비교 ······································································ 290
6.1.7 메모리상의 화상 데이터와의 비교 ··················································· 291
6.2 화상 데이터의 절감법 ··············································································· 292
6.2.1 정점 샘플링 ······················································································ 292
6.2.2 라인 ····································································································· 293
6.2.3 윈도우 ································································································· 295
6.2.4 마스킹(masking) ··············································································· 296
6.2.5 화상 데이터의 차원 압축 ································································ 296
6.3 비교 연산 ···································································································· 299
6.4 위치의 보정 ································································································ 301
6.5 판정 기준 데이터의 설정법 ····································································· 303
제 7장 신호 레벨 해석에 의한 결함 검출 ··············································· 305
7.1 개요 ·············································································································· 307
7.2 신호의 보정 ································································································ 308
7.3 결함부의 강조 ······························································································ 311
7.4 임계값 회로 ································································································· 312
7.5 검사 영역의 절단 ······················································································· 314
제 8장 2차원 화상 처리에 의한 결함 검출 ·············································· 319
8.1 개요 ·············································································································· 321
8.2 2치화와 화소의 분리 ················································································· 323
8.3 파이프라인 처리 회로 ··············································································· 325
8.4 국소 병렬 연산의 응용 예 ······································································· 329
8.5 PC의 이용 ··································································································· 332
제 9장 검사 장치의 구성 ············································································ 333
9.1 점 센서에 의한 형상 검사 장치 ······························································ 335
9.2 라인 센서에 의한 표면 결함 검사 장치 ················································· 338
9.3 영상 카메라를 이용한 윈도우 회로 ························································· 341
제 10장 성능의 검토 ··················································································· 343
10.1 개요 ············································································································ 345
10.2 정도 ············································································································ 345
10.3 분해능 ········································································································ 347
10.3.1 샘플링 정리 ······················································································ 347
10.3.2 촬상소자와 분해능 ·········································································· 349
10.3.3 Laser 주사와 분해능 ····································································· 350
10.3.4 렌즈의 해상력 ·················································································· 352
10.3.5 증폭회로와 분해능 ·········································································· 352
10.3.6 위치결정 정도의 영향 ···································································· 353
10.3.7 분해능의 향상 ·················································································· 354
10.4 검사 속도 ·································································································· 355
10.5 재현성 ········································································································ 356
10.6 그 밖의 평가 ····························································································· 357
저자
저자
홍준희
- 일본 동경대학 정밀기계공학 박사
- 전 건양대학교 제어계측공학과 전임강사
- 현재 충남대학교 공과대학 기계공학부 교수
저서
- 메카트로닉스 응용 수치제어공작기계
- 자동화를 위한 메카트로닉스
- 계측공학의 기초
- 메카트로닉스와 기계기술
- 생산 자동화 개론
- 레이저 응용 계측기술
- 기계공학과 전기전자의 융합 기전공학
역서
- 초보자를 위한 MATLAB
- 메카트로닉스를 위한 제어공학
- 계측과 신호처리
- 자기베어링의 기초와 응용
- 자기센서 이공학
- 그림으로 이해하는 메카트로닉스공학
- 전 건양대학교 제어계측공학과 전임강사
- 현재 충남대학교 공과대학 기계공학부 교수
저서
- 메카트로닉스 응용 수치제어공작기계
- 자동화를 위한 메카트로닉스
- 계측공학의 기초
- 메카트로닉스와 기계기술
- 생산 자동화 개론
- 레이저 응용 계측기술
- 기계공학과 전기전자의 융합 기전공학
역서
- 초보자를 위한 MATLAB
- 메카트로닉스를 위한 제어공학
- 계측과 신호처리
- 자기베어링의 기초와 응용
- 자기센서 이공학
- 그림으로 이해하는 메카트로닉스공학
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